Enclosures

Enclosures Wakefield

Cost pressures, decreasing package sizes and increased thermal requirements has our engineering team looking beyond the conventional methods of cooling. Wakefield Thermal Solutions, Inc. has pioneered the use of extrusions to incorporate the heat sink surface area as an integral part of the overall assembly. Many features can be added to an enclosure during the extrusion process, eliminating or minimizing the need for secondary machining. A well designed extruded enclosure can provide a complete, cost effective solution.