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Call:Style Outlines (images like TO-5 above) D Pak - TO-124 101k .gif, TO-126 - DO-9 101k .gif, DO-10 - misc. 101k .gif,
Board Level Power Extruded Heat Sinks for Semiconductor Heat Sinks Power Semiconductors Series Series Series Series 200 Series 290 Series 131 Series 476 Series 216 Series 291 Series 132 Series 486 Series 225 Series 292 Series 133 Series 489 Series 254 Series 295 Series 301 Series 490 Series 256 Series 296 Series 302 Series 502 Series 258 Series 297 Series 303 Series 503 Series 259 Series 298 Series 392 Series 505 Series 260 Series 330 Speed Clip 394 Series 510 Series 270 Series 601 Series 395 Series 511 Series 271 Series 603 Series 396 Series 512 Series 272 Series 626 Series 401 Series 621 Series 273 Series 627 Series 403 Series 623 Series 274 Series 635 Series 413 Series 641 Series 275 Series 637 Series 421 Series 860 Series 280 Series 647 Series 423 Series 2080 Series 281 Series 657 Series 431 Series 2081 Series 285 Speed Clip 667 Series 433 Series 2090 Series 286 Series 677 Series 435 Series 2091 Series 287 Series 680 Series 441 Series 6050 Series 288 Series 690 Series 465 Series 6060 Series 289 Series 695 Series 860 Series Forced Convection Assemblies 6050 and 6060 Series Forced Convection Assemblies Bonded Fin Forced Convection Assemblies Bonded Fin Natural Convection Heat Sinks Custom Bonded Fin Heat Sinks Convoluted Fin Design and Stock Aluminum Extrusion Profiles
120 High-performance silicone oil-based thermal compounds
126 High-performance nonsilicone-based thermal compounds
151 Thermally conductive dielectric epoxy coating
152 Thermally conductive bonding adhesive.
153 Thermally conductive pouring casting resin
154 Medium viscosity aluminum filled resin
155 Thermally conductive epoxy adhesive
156 Thermally conductive adhesive
100-113 Teflon and nylon mounting insulators, washers, brackets, adapters
115/116/117/118 PC board wavesolderable fasteners
160-IT/260-IT Installation tools
170/171/172 Aluminum insulating wafers
173/174 Delta Pads - Thermally conductive insulators
175 Greaseless thermally conductive Kapton® reinforced insulator
177 Thermally conductive insulating beryllium oxide wafers and washers
178/179 Thermally conductive pressure-sensitive adhesive tapes
Kit No. 100 Board level power semiconductor engineering evaluation heat sink kit
Kit No. 200 Integrated circuit cooling engineering evaluation kit. Various
heat sinks for microprocessors, ASICs, and integrated circuits
Kit No. 300 Integrated circuit engineering evaluation kit for Intel PentiumTM
processors and IntelDX4TM processors
Device Diameter (max) Force Range (max) Series
in. (mm) lbs (kg)
2.250 (57.2) 2,000 (907.2) 130
3.500 (88.9) 5,000 (2268.0) 139
3.500 (88.9) 6,000 (2721.6) 143
4.000 (101.6) 6,000 (2721.6) 144
4.500 (114.3) 10,000 (4535.9) 145
5.250 (133.4) 16,000 (7257.5) 146
Press Pack Heat Sinks 131/132/133
Press Pack Extrusions
Description Mounting Pattern Series Liquid-Cooled Chill Blocks Press Pack 135/137 Liquid Cold Plates General, Isolated Flat Base 180-10/180-11 Liquid Cold Plates General, Isolated Flat Base 180-12/180-20 Liquid Cold Plates TO-3, General, isolated Flat Base 180-26 Custom Liquid Cold Plates General, Isolated Flat Base 180
Technical Discussion Section Integrated Circuit Heat Sinks Custom Aluminum Extrusion Profiles Custom Fabrications and Assemblies Design and Manufacturing Capabilities Extrusion Design and Standard Tolerances
Heat Sink Extrusion Profiles
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Compression Mounting Clamp
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Semiconductor Heat Sink Selection
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Thermal Compounds/Adhesives
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