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Catalog, Quote, Availability.
Distributors for
WAKEFIELD ENGINEERING
Heat Sink Extrusion Profiles and
Custom Fabricated Assemblies
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Wakefield Engineering heat sink extrusion profiles simplify the selection task and lower the cost of customizing a heat sink for an application undertaken by the OEM design engineer. We can also tailor a design to meet specific needs. These customized solutions serve two types of applications:
- Customized heat sinks designed to mount and cool arrays of power semiconductors for use within power supplies, enclosures, and equipment cabinets. We can reduce total component cost by supplying a common extrusion profile, which we can machine for mounting requirements for an array of heat generating components.
- Custom extruded aluminum enclosure panels, power supply base plates and side walls, and instrument front panels. Specify Wakefield Engineering for high-quality finished aluminum enclosure components when aesthetic appearance and finish quality are important to the appearance of your end product. Our finished product costs are competitive and often yield a higher quality solution.
Design Capabilities
Our Engineering Department is equipped with a state-of-the-art Hewlett-Packard/ Apollo CAD system and workstations with H-P ME-10 mechanical engineering and ME-30 3-D solids modeling software, used in combination with SRAC's COSMOS/M for finite element analysis and Flomerics' Flothermtm; computational fluid dynamic software for heat transfer analysis, for both component- and system-level application solutions. We employ proprietary software for design and analysis of heat exchangers, liquid-cold plates, and high-performance air-cooled components. Wakefield Engineering offers applications answers drawn from the best design tools available. Our engineering philosophy is driven by more than 30 years' experience in providing lowest-cost solutions for maximum heat transfer performance in commercial electronics.
Manufacturing Capabilities
Multiplant manufacturing operations at Wakefield Engineering provide cost-effective, high-quality finished components and assemblies.
Custom extruded assemblies such as amplifier enclosures, power supply face panels, and other enclosure panels are fabricated from custom aluminum extrusion profiles, with CNC milling and multi-spindle drilling and tapping operations, mounting hardware installation, and finishing. We have made major investments in CNC machining capability and custom-designed milling cells to support volume manufacturing requirements. Statistical process control (SPC) is utilized in volume cell-based manufacturing.
Finishing capabilities include anodizing, iriditing, epoxy powder coating, painting, and logo artwork marking. Other plating and finishing processes are also available. All finishing operations provide high-quality finished product appearance to meet rigorous aesthetic requirements.
Wakefield Engineering can provide complete design and fabrication assistance to develop a cost-effective, high-quality solution. When the appropriate design is complete, a production quotation will be provided with required attachment features, finish requirements, logo and part marking, and thermal interface materials and mounting hardware as needed.
Selected Standard Extrusion Profile Characteristics
Extrusion Overall Basic Weight Perimeter SA Standard
Profile Base Width Height Extrusion Form (lb per ft) (in.) (C/W) Series P/N
4753 3.14 in. ( 79.8) 1.31 in. (33.3) Flat Back2 1.89 23.8 2.50
1881 3.69 in. ( 93.8) 0.56 in. (14.2) Flat Back2 1.08 14.5 3.90
4562 3.82 in. ( 97.0) 1.00 in. (25.4) Flat Back2 1.62 21.6 2.50
4434P1 4.00 in. (101.6) 0.30 in. ( 7.6) Flat Back 0.55 16.8 5.20
1527 4.38 in. (111.3) 1.29 in. (32.8) Flat Back 2.58 37.3 1.40
3286 4.56 in. (115.9) 1.00 in. (25.4) Flat Back 1.28 24.9 2.40
2276 4.75 in. (120.7) 1.88 in. (47.8) Double Fin 2.39 35.0 1.50
5658 4.92 in. (125.0) 5.35 in. (135.9) Power Module 12.18 90.3 0.83 413
7330 5.00 in. (127.0) 2.50 in. (63.5) Double Fin2 2.55 55.8 1.70 392
7331 5.00 in. (127.0) 1.38 in. (35.1) Power Module2 1.90 33.8 3.00 395
7332 5.00 in. (127.0) 1.50 in. (38.1) Power Module2 1.71 37.8 2.50 396
2903 5.75 in. (146.1) 0.69 in. (17.5) Flat Back 1.72 23.9 2.80 394
1541 6.25 in. (158.8) 6.25 in. (158.8) Hex and Stud-Mount 7.80 105.7 0.59
4509 6.50 in. (165.1) 1.60 in. (40.6) Flat Back 3.45 53.8 1.30 486
6274 6.96 in. (176.8) 2.79 in. (70.9) Flat Back 9.15 101.0 0.80
3559-2 7.00 in. (177.8) 3.13 in. (79.5) SCR Pak 7.37 87.5 0.85
6438-2 7.20 in. (182.3) 2.41 in. (61.2) Flat Back3 5.13 77.7 0.90 133
4771 7.34 in. (186.4) 1.31 in. (33.3) Flat Back 4.54 63.3 1.10 511,512
4937 8.35 in. (212.1) 2.00 in. (50.8) Flat Back 5.55 58.1 0.85
5384 9.75 in. (247.7) 2.28 in. (57.9) Flat Back 7.40 100.0 0.75
1703 9.88 in. (251.0) 1.31 in. (33.3) Flat Back 6.16 80.3 0.90
4559 10.78 in. (273.9) 3.77 in. (95.8) Flat Back 16.8 87.9 0.50
4971 12.25 in. (311.2) 1.00 in. (25.4) Flat Back 7.13 63.8 1.30
5429 13.38 in. (339.9) 1.31 in. (33.3) Flat Back 8.61 107.4 0.70
Notes:
1. Thermal resistance, sink-to-ambient, per 3.0 in. (76.2) length in natural convection.
2. Center fin gap profile.
3. High fin density extrusion profile.
4. See index of standard part numbers for additional information under referenced standard P/N series.
Selected Standard Extrusion Profile Outlines
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© 1995 Wakefield Engineering
Heat Sink Extrusion Profiles