Wakefield Thermal Solutions, Inc. offers a wide range of board level power semiconductor heat sinks for surface mount and thru hole devices, including JEDEC/EIA registered outlines TO-3, TO-218, TO-220, TO-247, and TO-263 (D2PAK). Also covered are hex/stud mount diode outlines DO-4 to DO-11 as well as MULTIWATT® and axial lead devices. These products are available in stamped and extruded aluminum, and selected stampings are manufactured out of copper.

Higher Specifications:

Lower Specification: