Wakefield has expanded its already broad line of heat sink manufacturing technologies! Our latest product is the "SwageFin", Wakefield's version of the swaged fin heat sink. The SwageFin picks up where limitations of pure extrusions, bonded fin, and other technologies leave off. In a given volume, greater thermal performance is possible than either extruded or bonded fin heat sinks.

Fin ratios of greater than 20 to 1 are readily achieved, extending the fin height capability of extruded heat sinks. Even greater ratios can be attained in smaller heat sinks.

The metal-to-metal contact resistance from our swaging process is essentially zero, significantly reducing the overall thermal resistance compared to bonded fin. Thermal tests have shown a thermal resistance reduction of above 18 percent.

Due to the continuous metal contact from fin to base, the SwageFin can be anodized or electroplated. These finishes are in addition to the chemical conversion coatings possible with bonded and extruded heat sinks. In addition, it is possible to use different materials for the fin and the base, which gives the SwageFin another advantage over standard extrusions.

SwageFin heat sinks can be fabricated in a variety of sizes. In general, the fin pitch and general heat sink size capabilities match that of our bonded fin line. Wakefield is continually working to expand the application range of SwageFin, so we encourage you to contact us with your needs.